Ask a question or
Order this book


Browse our books
Search our books
Book dealer info



Title: Electronics Packaging Forum. Multichip Module Technology Issues
Description: Spublisher, "1994. IEEE Press, New York, 1994. VII, 392 pages with some graphics, hard cover, (library stamp inside) Einband: "gebundene Bücher. 705

Keywords: "Computertechnik

Price: EUR 9.00 = appr. US$ 9.78 Seller: Celler Versandantiquariat
- Book number: "1p3133