Author: "MORRIS, JAMES E. Title: Electronics Packaging Forum. Multichip Module Technology Issues
Description: Spublisher, "1994. IEEE Press, New York, 1994. VII, 392 pages with some graphics, hard cover, (library stamp inside) Einband: "gebundene Bücher. 705
Keywords: "Computertechnik
Price: EUR 9.00 = appr. US$ 9.78 Seller: Celler Versandantiquariat
- Book number: "1p3133